IBM HPC Summit 2009 Olivier Multon HPC Business Development Executive

Agenda 8h45 Accueil des participants 9h15 Introduction IBM Deep Computing Executive 9h30 Solutions de calcul IBM et nouvelles plate-formes modulaires idataplex Olivier Multon - IBM France 10h00 Nouvelle architecture Intel Xéon et ses applications en HPC Philippe Thierry - Intel France 10h30 Pause 11h00 Le centre de calcul de l IN2P3 à Lyon et l intégration d un idataplex Dominique Boutigny - Directeur du centre de calcul IN2P3 11h30 Une solution idataplex pour le traitement des données HFI-Planck Philippe Parnaudeau - Institut d'astrophysique de Paris 12h00 Le NAS performant et évolutif ré-inventé avec IBM "ScalesOut FileServices" François Bothorel - IBM France 12h30 Cocktail déjeunatoire 2

High Performance Computing @ IBM Olivier Multon HPC Business Development Executive

Agenda Les défis du HPC et l innovation chez IBM Actualité du BlueGene et Power Nouveautés clusters IBM x86 et systèmes idataplex 4

IBM supercomputing leadership November 2008 November 2008 TOP100 IBM is clear leader with 33% IBM; 33 Other; 17 Semiannual independent ranking of top 500 November in2008 Aggregate supercomputers the world SGI; 7 Performance IBM: 6,676 of 16,967 TF (39%) Cray; 13 Dell; 12 Dell 4,1% HP; 18 Sun 3,2% NEC 0,7% Other 6,1% IBM 39,4% IBM leads key TOP500 metrics... ü QS22/LS21 at LANL still #1 (1.105 Petaflops) ü Most aggregate perf with 6.7 of 17 Petaflops (39%) ü Most systems in TOP20 by any single vendor (6) ü Most systems in TOP100 systems with 33 (33%) ü Fastest machine in USA (QS22/LS21 at LANL) ü Fastest machine in Europe (Blue Gene/P at Juelich) ü Most power efficient systems (QS22 based) ü Most power efficient x86 system (HS21 at Umea) Cray 14,7% SGI 7,2% HP 24,7% Source: www.top500.org 5

Top500 Processor Technology Novembre 2008 Intel technology is the processor in 76% of the systems followed by POWER in 12% of systems followed by Opteron at 11.8% November 2008 TOP500 Processor Technology PowerXCell 8i, 1,4% PPC 450, 2,4% Sparc, 0,2% Opteron QC, 6,0% Opteron DC, 5,8% NEC, 0,2% Itanium2, 1,8% PPC 440, 2,8% EM64T, 0,2% PPC 970, 1,0% DC Xeon, 15,2% POWER6, 2,4% POWER5, 2,0% QC Xeon, 58,6% Legend Legend Processor, Processor, %%ofoftop500 TOP500 Systems Systems Notes: PowerPC 970 includes 1Apple Xserve system, POWER5 includes 1 Hitachi system Source: www.top500.org 6

Les challenges déjà adressés par IBM La consommation électrique: BLUE GENE/L DOE LLNL dissipe 1.5MW pour une puissance de 280TFLOPS Le refroidissement et la pollution acoustique. Portes arrières réfrigérantes «Cool Blue» pour rack T42 et idataplex Side Car Cooling pour absorber la chaleur et le bruit. La densité: BLUE GENE/P : 4000 processeurs (14 TFlops) dans un rack. Maîtrise du DUAL CORE depuis 2001(p575 /16CPUS POWER5+ dans 2U). Introduction en 2006 du Blade Center 2 (224 CPUS par châssis). 84 serveurs soit 672 cœurs Intel Xéons par rack idataplex CELL Architecture (8 CPUS on Chip) (alliance Sony, Toshiba, IBM). La performance: P5+ en 2006,1.9GHz (dual-core) et 2.2GHz (SINGLE CORE) (90nm). Actuellement le POWER6 @ 4.7GHz (2007 / 65nm). La facilité de gestion Outils d administration (IBM Director, CSM, xcat2) Facilité et efficacité d accès aux données (GPFS, DCV) 7

Agenda Les défis du HPC et l innovation chez IBM Actualité du BlueGene et Power Nouveautés clusters IBM x86 et systèmes idataplex 8

February 03, 2009 Lawrence Livermore Prepares for 20 Petaflop Blue Gene/Q by Michael Feldman, HPCwire Editor Building on its Blue Gene heritage, IBM will deliver "Dawn," a 500 teraflop Blue Gene/P system in the first quarter of this year, followed by "Sequoia," a 20 petaflop next-generation Blue Gene/Q machine for 2011. Sequoia is expected to officially go online in 2012. The new machines will take over Lawrence Livermore's weapon simulation codes that are being maintained under the Advanced Simulation and Computing (ASC) Program. Currently this work is being done with the existing capability supercomputers at the lab: the 100 teraflop ASC Purple and the 600 teraflop Blue Gene/L. IBM is not releasing low-level details of the Blue Gene/Q architecture. However, since Sequoia will be composed of 98,304 compute nodes and contain a total of 1.6 million cores, one can surmise that a Blue Gene/Q node will contain 16 cores. Whether this is implemented as one 16-core chip or two 8-core chips (or even four quad-core chips) remains to be seen. Since Sequoia will sport 1.6 petabytes of memory, each node stands to have 16 GB. The current Blue Gene/P technology offers 4 cores and 4 GB of main memory per node. At 20 petaflops, Sequoia will be 160 times as powerful as Lawrence Livermore's ASC Purple and 17 times as powerful as its current Blue Gene/L, giving scientists a lot more computing cycles for weapons simulations and basic science research. "It's been an interesting journey," notes Turek. "When you think back to when the ASCI [now ASC] program was launched in the 90s and what the aspirations were for FLOPs back then versus where we are today, I think we've exceeded everyone's expectations." 9

What is Blue Gene/P? System up to 256 racks Rack Blue Gene continues its leadership performance in a space-saving, powerefficient package for the most performance- demanding applications Quad-Core PowerPC System-on-Chip (SoC) 32 Node Cards up to 64x10 GigE I/O links Cabled up to 3.56 PF/s 512 or 1024 TB Node Card 32 Compute Cards up to 2 I/O cards 14 TF/s 2 or 4 TB Compute Card 1 chip, 20 DRAMs 435 GF/s 64 or 128 GB Chip 4 processors 13.6 GF/s 2 or 4 GB DDR2 The system scales to 256 racks achieving 3.56 PF/s peak 13.6 GF/s 8 MB EDRAM 10

A 3 Year Comparison of Typical Cluster vs. BG/P TCO for 100 Linpack TeraFLOPs. $30,000,000 2+3Yr Warranty $25,000,000 Connectivity $20,000,000 $15,000,000 Floor Space $10,000,000 $5,000,000 $0 11 Cluster Blue Gene/P POWER @ 10 cents/kwhr HW

Recent Blue Gene/P customers installations TIFR: Tata Institute of Fundamental Science: 1 rack BG/P Cray displacement in India, first BG/P in Asia ASTRON: Netherlands Institute for Radio Astronomy: 3 racks BG/P Replaced 6 racks of BG/L with 3 racks of BG/P at University of Groningen University of Rochester NY: 1 rack BG/P Meraka Institute: Center for High Performance Computing: 1 rack BG/P First Blue Gene/P in Africa Dassault Aviation: 1 rack BG/P For Computational Fluid Dynamics work KAUST: King Abdullah University: 4 racks BG/P Beginning of 16 rack installation Lawrence Livermore National Labs: 37 racks BG/P 500TF installation for Nuclear Safety Agency Juelich Supercomputing: 72 racks BG/P PETAFLOP (June) First Blue Gene PetaFLOPs computer, First production liquid cooled Blue Gene 12

New JS23/JS43 Blade (2Q 2009) Four dual-core 4.2GHz POWER6, 64-bit processors with AltiVec SIMD and Hardware Decimal FP Acceleration - 4MB per processor core level 2 (L2) Cache - 32MB per processor socket level 3 (L3) Cache 4GB ECC DDR Chip kill memory (expandable to 128GB) Two hard disk drive Dual integrated 1Gbit Ethernet Service Processor SAS controller One serial/console port (via Serial over LAN) OS Support: - Red Hat RHEL 4.7, 5.2 or later* - SUSE Linux SLES10 SP2 or later - Current versions of IBM AIX 5L V5.3 and AIX V6.1 i 6.1 with the PowerVM Standard Edition Virtual I/O Server. 13

Agenda Les défis du HPC et l innovation chez IBM Actualité du Power6 et annonce du p575 P6 Nouveautés clusters IBM x86 et systèmes idataplex 14

Les nœuds de calcul x86 d IBM x3755 x3850 4U, 4 Socket 3U, 4 Socket HS21/LS21/LS41/JS22/QS22 Processeurs Opteron/Xeon ou POWER Proc: Opteron QC Proc: Xeon MP Mem: 32 DIMM / 128GB Mem: 16 DIMM / 64GB HDD: 4 SAS HS HDD: 6 SAS HS 2,5 PCI: 4 PCI-E, 2 PCI-X, 1HT PCI: 6 Acitve PCI-X Alim: 2 HS Alim: 2 HS x3455 x3550 x3650 x3655 1U, 2 Socket 1U, 2 Socket 2U, 2 Socket 2U, 2Socket x3450 1U, 2 Socket Proc: Opteron QC Proc: Xeon DC & QC Proc: Xeon DC & QC Proc: Opteron Proc: Xeon DC & QC Mem: 12 DIMM / 48GB Mem: 8 DIMM / 32GB Mem: 12 DIMM / 48GB Mem:16 DIMM / 64GB Mem: 16 DIMM / 64GB HDD: 2 SATA SS HDD: 2 SATA SS ou 4 SAS HS 2,5 HDD: 6 SAS HS 3,5 ou 8 SAS HS 2,5 HDD: 6 SAS HS 3,5 ou 8 SAS HS 2,5 HDD: 2 SATA SS PCI: 2 PCI-E PCI: 4 PCI-E PCI: 3 PCI-E et 1 HT Alim: 2 HS Alim: 2 HS Alim: 2 HS PCI: 2 PCI-E Alim: 1 fixe 15 PCI: 1 PCI-E Alim: 1 fixe

Update CPUS x86 AMD SHANGAI: Q1 2009 INTEL NEHALEM: Q2 2009 16

AMD SHANGAI Lancement Q4 2008 Troisième génération sockets F (série 2000 et 8000) 2.7GHz max (105W) (Barcelona 2.5Ghz max.) Gravure à 45nm (Barcelona /65nm) DDR2 800MHz (Barcelona 667MHz ) 6MB L2 cache (Barcelona 3MB) HT3: 16GB/sec par lien sur SHANGAI versus 8GB/sec sur BARCELONA 17

AMD SHANGAI RDDR-3 HT3 HT3 Extensive Extensive I/O I/O Expandability Expandability HT3 SR5690 SR5690 I/O Hub I/O Hub IOMMU IOMMU 42 PCIe Lanes with 11 controllers Processor Support Shanghai (4 cores) Istanbul (6 cores) Chipset Support SR5690/SP5100 High High Performance Performance PCIe PCIe Gen.2 Gen.2 42 PCIe Lanes with 11 controllers PCIe x4 SP5100 South Bridge ATI ES-1000 GPU HT3 Performance Shanghai HT3 18 18 Max Frequency 800MHz with 8GB per CPU July 2008 2006 IBM Corporation Max Capacity Max Bandwidth 16GB per CPU at 533MHz 12.8GB/s@ 800MHz Server/Workstation Processor Roadmap Istanbul* 17.6 GB/s (4.4 GT/s) 19.2 GB/s (4.8 GT/s) DDR2 Memory Support Fiorano Platform Virtualized Virtualized I/O I/O Acceleration Acceleration *asking for HT3 design work to be done to support 20.8GB/s (5.2GT/s)

AMD CPU Roadmap MP/DP Platforms - 8000 and 2000 Series CPU 8000 Series 2009 2008 2010 Socket Socket F(1207) F(1207) Maranello Maranello -- RDDR-2 RDDR-2 (Dual (Dual Channel) Channel) Socket F (1207) -- 33 xx HT-1 HT-1 - RDDR-2 (Dual Channel) - HT31 -- Socket -- U/RDDR3 Socket G34 G34 U/RDDR3 -- 44 xx HT-3 -- IOMMU HT-3 IOMMU -- Enhanced Enhanced APML APML -- HTC HTC -- Probe Probe Filter Filter Fiorano - Socket F (1207) - RDDR-2 (Dual Channel) - HT31 Barcelona Barcelona 4-Core 4-Core -- 2M 2M L3 L3 -- AMD-V AMD-V -- 65nm 65nm Q208 2000 Series -- 4-Channel 4-Channel Memory Memory -- 12M -- 45nm 12M L3 L3 45nm -- AMD-V AMD-V 6-Core 6-Core 4-Core 4-Core Q109 -- 6M 6M L3 L3 -AMD-V -AMD-V -IOMMU -IOMMU -APML -APML -Probe -ProbeFilter Filter -45nm -45nm Q409 AMD AMD SR5690 SR5690 AMD AMD SR5670 SR5670 AMD AMD SP5100 SP5100 Nvidia Nvidia nforce nforce 3600/3050/2200/2050 3600/3050/2200/2050 Broadcom HT-2100/1000/1100 Broadcom HT-2100/1000/1100 1 Sao Sao Paulo Paulo22 19 July 2008 2006 IBM Corporation Server/Workstation Processor Roadmap 1H10 8-Core 8-Core -- 4-Channel 4-Channel Memory Memory -- 12M -- 45nm 12M L3 L3 45nm -- AMD-V AMD-V AMD AMD SR5690 SR5690 AMD AMD SR5670 SR5670 AMD AMD SP5100 SP5100 2300 Series supports 1 cht3 link (or 2 in dual-link mode). 8300 Series supports up to 3 cht3 links. ncht3 support dependant upon chipset. 2 Up to 4 Socket Support Only 19 1H10 12-Core 12-Core Istanbul Istanbul Shanghai Shanghai 8 -- 6M 6M L3 L3 -- AMD-V AMD-V -- 45nm 45nm Magny-Cours Magny-Cours22 Chipset Chipset 65 nm 45nm Red type denotes new features

INTEL «NEHALEM» X5550 Nehalem remplace l architecture FSB Contrôleur mémoire intégré Support natif de la mémoire DDR3 Quick Path interconnect: Système d interconnexions point à point à très hautes performances pour communiquer avec les périphériques et d autres CPU 3 niveaux de cache Fréquence : 2.66, 2.80 ou 2.93GHz Technologie 45nm Nombre de cœurs par socket : 4 Hyperthreading : chaque cœur peut traiter deux threads simultanément. 20

Le marché des serveurs lames: les lames représentent une tendance de fond x86 Revenue by Form Factor 100% 80% 60% Non-Rack Optimized Rack-optimized Blade 40% 20% 0% Source IDC 21 2003 2004 2005 2006 2007 2008

IBM BladeCenter les lames. le châssis Jusqu à 4 procs par lames Jusqu à 14 lames par chassis La lame dispose de : Le Châssis permet le partage de Processeur Console de management, Mémoire Clavier, écran, souris (KVM) Disque Alimentation Connexion Ethernet Ventilation Cartes I/O optionnelles I/O: Switchs réseau, SAN, Infiniband et jusqu à 4 chassis (9U) par rack soit 56 serveurs! DVD, Disquette, port USB 22

HS4X Blade HS2X Blade Introduced 2002 Up to two Xeon 3.0GHz / Up to 14 per chassis Introduced 2003 Up to four Xeon 3.0GHz / JS2X Blade Up to 7 per chassis POWER6 4.0GHz Introduced 2004 Up to two Up to 14 per chassis LS2X Blade Introduced 2005 Cell Blade QS22 18 cores per blade Up to 7 per chassis Flexibilité et évolutivité BladeCenter 3nd génération de lames 23 Up to four AMD Opteron Up to 14 per chassis LS4X Blade Introduced 2005 Up to eight AMD Opteron Up to 7 per chassis

Le problème Densité / Alimentation / Dissipation Les besoins des CPU en énergie diminuent avec les nouvelles technologies pour le moment Alimentation Systèmes certains composants consomment moins, d autres pas La problèmatique d alimentation sur les serveurs Rack implique d augmenter la densité des composants 35 175 25 20 100 CPU 75 10 Vous êtes ici 50 15 Rack Power - watts Thousands CPU Power - watts Rack 125 Other 44% Memory 11% HDD 6% 5 25 0 0 2001 2003 2002 24 Processor 30% 30 150 2005 2004 2007 2006 2009 2008 2010 Standby 2% PCI Planar 3% 4%

Vision d IBM pour les Green Data Centers Avant la fin de la décennie, IBM aura Réduit la consommation des serveurs de 50% Diminution des coûts par une meilleure gestion de l énergie Supprimé les indispensables centrales de climatisation Amélioré la densité des calculateurs d un facteur 10 Puissance de calcul décuplée sans nouvelle construction Recyclé les anciennes générations de serveurs 25

idataplex: l innovation IBM pour les clusters x86! 26

Customers who say idataplex IS the RIGHT solution idataplex: Proven Benefits for Customer Challenges IBM listened and delivered -Robert Dunn, Executive Director Morgan Stanley Technology Microsoft is excited to work with IBM on ensuring that Windows HPC Server 2008, with its advanced power management capabilities, is a perfect complement to the idataplex system for a broad range of HPC applications. - Kyril Faenov, General Manager of Microsoft High Performance Computing The University of Toronto has partnered with IBM [idataplex] to become one of the world's premier computational research institutions -- a collaboration that will attract researchers from around the world. -Dr. Richard Peltier, Scientific Director of SciNet and Director of the Centre for Global Change Science 27

Offre idataplex disponible depuis mi-2008 Rack idataplex optimisé pour les centres de calcul en termes de refroidissement, densité et facilité de déploiement Economie d espace et d énergie: 138% d amélioration de densité (100U) 50%+ de réduction de la surface au sol 75% de ventilateurs en moins 66% de puissance pour le refroidissement Simple à mettre en oeuvre et à piloter: 47.2 Accès aux serveurs et au câblage en face avant. 19 19 1 rack idataplex 672 core INTEL Xéons (Stoackley) 23.6 Top View 8.1TFLOPS 30kW 28 AIR FLOW AIR FLOW

Nouveau format plus dense et efficace Rack Management Appliance 2U Chassis idataplex Rear Door Heat Exchanger Web Server HPC Server Switches Storage Tray Storage Drives & Options I/O Tray PDUs 3U Chassis 29

Réduction d espace et de la consommation Top View 42U Enterprise Rack 1 42U Enterprise Rack 2 Optional Rear Door Heat Exchanger Typical Enterprise Rack idataplex x3550 (1U) vs. idataplex Impedance Curve Per 1U Half fan air depth 1 Doublement du nombre de serveurs par armoire Racks de 50% de profondeur sur 200% de largeur 100U d espace utile - 84U de serveurs + 16U composants d interconnexion Economie d espace, réduction de TCO, etc. 0.9 0.8 Impedance (inh 2O) Full fan air depth 0.7 idataplex has 30-40% lower airflow impedance 0.6 0.5 0.4 0.3 0.2 0.1 0 Efficacité des alimentations et des systèmes de ventilation Profondeur réduite 20% de réduction des coûts de refroidissement Option de porte réfrigérée Elimination totale de la dissipation calorifique jusqu à 100.000 BTUs 30 0 10 20 30 40 50 60 70 80 90 Air Flow per 1U (CFM) idataplex 2 Planar Node x3550

A New Way to Cool the Data Center Liquid cooling at the rack is 75%95% more efficient than air cooling by a CRAC Eliminate rack heat exhaust No electrical or moving parts No condensation Chilled water or evaporative liquid Provides Up to 67% Cooling Power Reduction 31

Empreinte au sol réduite de 20% à 240% Schéma par dalle de plancher 400 CFM par dalle Allée froide Allée froide Std Std X sq. ft Refroidi Rack Rack w/ 1U s w/ 1U s à l air 32 0.79x sq. ft Refroidi à l air Densité réduite de 2.4x 0.42x sq. ft Porte à eau Allée froide IDPx Rack IDPx Rack Allée Chaude Allée Chaude Allée Chaude IBM Confidential

Density comparison of a Heterogeneous Datacenter (43 x 62 floor space) ck a R d ar d an t S ut o lay 168 Standard Racks 7,728 Horizontal U s 36 idataplex Racks and 96 Standard Racks 8,088 Horizontal U s (5% increased density) ut o ay l zed i tim p o x e l P a t ida 84 idataplex Racks and 28 Standard Racks 9,856 Horizontal U s (28%) 33 126 idataplex Racks 12,852 Horizontal U s (66%)

Réduction des coûts liée au nouveau chassis High-Efficiency Shared Power Supply High-efficiency Shared Cooling Fans Half the Server Fan Power for 1Us! 70 60 Dual Independent Motherboards 50 Améliorations dans environnement existant Chassis idpx 2U nécessite 2 fois moins de refroidissement que 2 serveurs 1U 40 30 20 Ventilateurs idpx consomment 2% de la puissance 10 totale du serveur (au lieu de 10%) 0 idpx est compatible avec les flux d air déjà utilisés dans le centre de calcul Standard 1U idataplex (Est.) Watts Fan Wattage-Max 34 BladeCenter H Fan Wattage-Typical

Nouvelles alimentations Utilisation efficace de la puissance électrique: Rendement de 90% des alimentations 375W & 900W, bientôt 700W pour 2 serveurs! Support des processeurs standards où à faible consommation BIOS optimisé 375W Single-zone System* 1U Server idataplex Minimum power draw 222W 138W Maximum power draw 288W 195W 40% d économie! 900W Dual-zone * Dual Intel LV Processors, 8GB Memory (4x 2GB), 4x 500GB SATA Disks, 1U server w/ 450W P.S. and idataplex w/ 375W P.S. 35

Refroidissement efficace à coût réduit Réduction des coûts par consolidation des unités de refroidissement et de ventilateurs optimisés Industry Standard idataplex Delta FFB0812UHE Delta QFR0812UHE Maximum Pressure: Maximum Airflow: Maximum Speed: Power @ 7500 RPM: 36 1.233 inh2 O 102 CFM 7500 rpm 18 W Maximum Pressure: Maximum Airflow: Maximum Speed: Power @ 9000 RPM: 1.335 inh2 O 105 CFM 9000 rpm 13 W

Noeud de calcul idataplex dx360 Serveur optimisé pour le HPC Jusqu à 64Go de mémoire Bi-processeur quadri-coeur avec 16 emplacements mémoires Intel Xeon Quad Core Harpertown Ethernet Dual 1Gbit 1600 MHz FSB E5472 (3.0GHz), 5462 (2.8GHz) 1333 MHz FSBLV 5420 (2.5GHz) Ethernet chipset Intel A2563 EB dual port Chipset Intel 5400 (Seaburg 1600MHz FSB) SATA Storage, ports Intel ESB2 SATA, 6 ports, SATA2 Northbridge Intel 5400 MCH USB 3 USB2.0, 2 external, 1 internal Southbridge Intel ESB2E 6321 Serial port 1@ 9-pin D Memory Type DDR-2 Fully Buffered DIMM s, ECC Motherboard size 12 x 13 Memory Size 16 FB-DIMM s, max. 64GB Slots 1U riser PCIe x16 elect., x16 mech Memory Speed PC2-5300-667 Slots 2U riser 2@PCIe x8 elect., x16 mech Memory Bus 4 channels Validated Operating Systems Red Hat Linux Enterprise Server 5 64 bit, SUSE Enterprise Linux 10 SP1 64 bit Video Controller ATI ES1000, 32MB SDRAM CPU Types 37

Ensemble de noeuds de calcul, d I/O ou mixtes Optimized for Compute Density Two server nodes in a 2U Chassis Dedicated PCIe and storage capability Optimized for Storage Choice of Five 3.5 (SAS / SATA) or eight 2.5 SAS Drives per Server node Optimized for I/O One server node in a 2U Chassis Two PCIe I/O Slots Choice of two 3.5 (SAS / SATA) or four energy efficient 2.5 SAS Drives Storage Rich Server One server node in 3U Chassis Additional twelve 3.5 750GB hotswap drives for total of 9TB with optional Raid-5 Outstanding $/GB affordability 38

dx360 M2 (TianMu Next generation feature/function Q109 Two Intel Quad Core processors (Nahelam Processors) 16 DIMMs DDR3 memory Support for 1333/1066 & 800Mhz 128GB Max Memory Support for Flexible disk options Solid State, SATA or SAS Flexible PCI-E Slots Dual Gig-E Ethernet Integrated BMC KVM over IP support with ibmc Consistent management IBM Director and AEM support Great New Features, Consistent Management High Performance Server Announce: March 2009 Availability: April 2009 39

New dx360 M2 Compute Node (16X) Memory DIMM s Mini PCIe SAS Card 8X Internal PCIe daughter card Hard drive carrier (2X) Nehalem Processors 16X PCIe Riser card VGA 40 2 USB 2 GbE GbE management port

Références IBM idataplex en France Institut Astrophysique de Paris 13TFlops, 140 noeuds, 500To disques IN2P3 Lyon 35TFlops, 412 serveurs, 5 racks avec RDHX INRA Toulouse 40 noeuds dans racks 19 MacGuff 240 serveurs dans 3 racks avec RDHX 41

Concept de l IBM Portable Modular Data Center Container de 40 fermé 18 IBM idataplex avec 84 servers chacun 18 IBM idataplex échangeurs à porte froide 42 IBM Confidential

Concept du PMDC Avantages Solution de calcul à très haute densité Jusqu à 18 racks de 32kW/rack pour 1512 serveurs idataplex Composants standards disponibles partout Utilisation efficace de l espace Refroidissement efficace Déploiement rapide: Build once, deploy anywhere, reuse anywhere, replicate as needed Duplicable sur plusieurs sites Configuration possible avec des racks 19 standards et d autres types de serveurs. Facile à déplacer (camion, train, avion) Compute / Install Position 43 Flexible, modulaire et recyclable Support IBM IBM Confidential

Questions? 44